AM263P4 datasheet(87/168 Pages) TI2

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6.10 Thermal Resistance Characteristics

This section provides the thermal resistance characteristics used on this device.

For reliability and operability concerns, the maximum junction temperature of the device has to be at or below

the TJ value identified in Section 6.5, Recommended Operating Conditions.

6.10.1 Package Thermal Characteristics

It is recommended to perform thermal simulations at the system level with the worst-case device power consumption.

PARAMETER

DESCRIPTION

℃/W(1) (2)

AIR FLOW (m/s)

(3)

RΘJC

Junction-to-case

5.4

N/A

RΘJB

Junction-to-board

5.3

N/A

RΘJA

Junction-to-free air

18.7

RΘJA

Junction-to-moving air

12.4

11.2

10.6

ΨJT

Junction-to-package top

0.12

0.35

0.47

0.56

ΨJB

Junction-to-board

5.1

4.6

4.5

(1)

These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC defined 1S0P system) and change based on environment as well as application. For more information, see these EIA/JEDEC

standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Packages

(2)

℃/W = degrees Celsius per watt

(3)

m/s = meters per second

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AM263P4, AM263P2, AM263P4-Q1, AM263P2-Q1

SPRSP81D – OCTOBER 2023 – REVISED MAY 2025

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