www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

32X (0.2)

32X (0.6)

(

0.2) VIA

28X (0.4)

(3.8)

(3.8)

(

1.4)

(R0.05)

TYP

VQFN - 1 mm max height

RSM0032A

PLASTIC QUAD FLATPACK - NO LEAD

4219107/A 11/2017

SYMM

1

8

9

16

17

24

25

32

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:20X

33

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED METAL