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BQ40Z50-R2 数据表(PDF) 54 Page - Texas Instruments |
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BQ40Z50-R2 数据表(HTML) 54 Page - Texas Instruments |
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54 / 55 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 32X (0.6) 32X (0.2) 28X (0.4) (3.8) (3.8) ( 1.3) (R0.05) TYP VQFN - 1 mm max height RSM0032A PLASTIC QUAD FLATPACK - NO LEAD 4219107/A 11/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 33 SYMM METAL TYP SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD 33: 86% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X SYMM 1 8 9 16 17 24 25 32 |
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