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STE2002 数据表(PDF) 58 Page - STMicroelectronics |
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STE2002 数据表(HTML) 58 Page - STMicroelectronics |
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58 / 61 page ![]() Mechanical data STE2002 58/61 8 Mechanical data Figure 53. Die orientation in tray Table 30. Bumps Bump number Dimensions Bumps on single row size 1-187 212-235 256-260 283-323 30 µm x 98 µm x 17.5 Bumps on two rows size 188-211 236-255 261-282 30 µm x 87 µm x 17.5 Pad size 1-323 43 µm x 107µm Pad pitch 1-323 50 µm Spacing between bumps 1-323 20 µm Table 31. Die mechanical dimensions Die size 2.07mm x 7.32mm Wafers thickness 500 µm STE2002 DIE IDENTIFICATION Mark 1 Mark 2 Mark 4 Mark 3 |
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