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AT80C51RA2-RLSIV 数据表(PDF) 58 Page - ATMEL Corporation |
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AT80C51RA2-RLSIV 数据表(HTML) 58 Page - ATMEL Corporation |
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58 / 86 page ![]() 58 4188F–8051–01/08 AT/TS8xC51Rx2 11. Electrical Characteristics 11.1 Absolute Maximum Ratings 11.2 Power Consumption Measurement Since the introduction of the first C51 devices, every manufacturer made operating Icc measure- ments under reset, which made sense for the designs were the CPU was running under reset. In Atmel new devices, the CPU is no more active during reset, so the power consumption is very low but is not really representative of what will happen in the customer system. That’s why, while keeping measurements under Reset, Atmel presents a new way to measure the operating Icc: Using an internal test ROM, the following code is executed: Label: SJMP Label (80 FE) Ports 1, 2, 3 are disconnected, Port 0 is tied to FFh, EA = Vcc, RST = Vss, XTAL2 is not con- nected and XTAL1 is driven by the clock. This is much more representative of the real operating Icc. 11.3 DC Parameters for Standard Voltage TA = 0°C to +70°C; VSS = 0 V; VCC = 5 V ± 10%; F = 0 to 40 MHz. TA = -40°C to +85°C; VSS = 0 V; VCC = 5 V ± 10%; F = 0 to 40 MHz. Ambiant Temperature Under Bias: C = commercial......................................................0°C to 70°C I = industrial ........................................................-40°C to 85°C Storage Temperature .................................... -65°C to + 150°C Voltage on VCC to VSS ........................................-0.5 V to + 7 V Voltage on Any Pin to VSS........................-0.5 V to VCC + 0.5 V Power Dissipation .............................................................. 1 W *NOTICE: Stresses at or above those listed under “ Abso- lute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Power dissipation is based on the maximum allowable die temperature and the thermal resis- tance of the package. Table 11-1. DC Parameters in Standard Voltage Symbol Parameter Min Typ Max Unit Test Conditions VIL Input Low Voltage -0.5 0.2 VCC - 0.1 V VIH Input High Voltage except XTAL1, RST 0.2 VCC + 0.9 VCC + 0.5 V VIH1 Input High Voltage, XTAL1, RST 0.7 VCC VCC + 0.5 V VOL Output Low Voltage, ports 1, 2, 3, 4, 5(6) 0.3 0.45 1.0 V V V IOL = 100 µA(4) IOL = 1.6 mA(4) IOL = 3.5 mA(4) VOL1 Output Low Voltage, port 0 (6) 0.3 0.45 1.0 V V V IOL = 200 µA(4) IOL = 3.2 mA(4) IOL = 7.0 mA(4) VOL2 Output Low Voltage, ALE, PSEN 0.3 0.45 1.0 V V V IOL = 100 µA(4) IOL = 1.6 mA(4) IOL = 3.5 mA(4) |
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