TSB14C01A, TSB14C01AI, TSB14C01AM

5-V IEEE 1394-1995 BACKPLANE TRANSCEIVER/ARBITER

SGLS107A – FEBRUARY 1999 – REVISED NOVEMBER 1999

7

POST OFFICE BOX 655303

– 0.5 V to 6.0 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TSB14C01AI

– 40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TSB14C01AM

– 55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR‡

ABOVE TA = 25°C

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

TA = 125°C

POWER RATING

HV

1689 mW

13.5 mW/

°C

1081 mW

879 mW

337 mW

PM

1602 mW

12.8 mW/

°C

1025 mW

833 mW

—

‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA)andusesaboard-mountedRθJAof78°C/WforthePMpackage

and 74

°C/W for the HV package.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC

4.5

5

5.25

V

High level input voltage VIH

CMOS inputs

0.7 VCC

V

High-level input voltage, VIH

TTL input

2

VCC

V

Low level input voltage VIL

CMOS inputs

0

0.2 VCC

V

Low-level input voltage, VIL

TTL input

0

0.8

V

Input voltage, VI

CMOS/TTL

0

VCC

V

High level output current IOH

CMOS Drivers

12

mA

High-level output current, IOH

TTL Drivers

8

mA

Low level output current IOL

CMOS Drivers

24

mA

Low-level output current, IOL

TTL Drivers

8

mA

TSB14C01A

115

Virtual Junction Temperature, TJ §

TSB14C01AI

125

°C

TSB14C01AM

150

TSB14C01A

0

70

Operating Free-Air Temperature, TA

TSB14C01AI

–40

85

°C

TSB14C01AM

–55

125

§ Actual junction temperature is a function of ambient temperature, package selection, power dissipation, and air flow. Customer is responsible

for maintaining the junction temperature within the recommended operating conditions. Operating device at junction temperatures higher than

what is recommended will cause device to operate outside the characterization models established during device simulation and may affect the

reliability performance.