TSB14C01A, TSB14C01AI, TSB14C01AM

5-V IEEE 1394-1995 BACKPLANE TRANSCEIVER/ARBITER

SGLS107A – FEBRUARY 1999 – REVISED NOVEMBER 1999

8

POST OFFICE BOX 655303

electrical characteristics over recommended ranges of operating conditions (unless otherwise

noted)

device

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VOH

High-level output voltage

IOH = max,

VCC = min

VCC– 0.8

V

VOL

Low-level output voltage

IOL = min,

VCC = max

0.5

V

Input current

VI = VCC or 0

±1

µA

IOZ

Off-state output current

VI = VCC or 0

±10

µA

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

R

θJA

Junction-to-free-air thermal resistance

TSB14C01APM,

TSB14C01AIPM

Board mounted, No air flow

78

θJA

TSB14C01AMHV

,

74

R

θJC

Junction-to-case thermal resistance

TSB14C01APM,

TSB14C01AIPM

16

θJC

TSB14C01AMHV

3

† Thermal characteristics vary depending on die, leadframe, pad size, and mold compound. These values represent typical die and pad sizes for

the respective package. The R

θJA value decreases as the die pad size increases. Thermal values represent PWB bands with minimal amount

of metal.

PARAMETER

MEASURED

TEST CONDITION

MIN

TYP

MAX

UNIT

tsu

D, CTL, LREQ low or high before SCLK high

50% to 50%

See Figure 1

7

ns

th

D, CTL, LREQ low or high after SCLK high

50% to 50%

See Figure 1

1

ns

td

Delay time, SCLK high to D, CTL high or low

50% to 50%

See Figure 2

10

ns

NOTE 1: These parameters are ensured by design and are not production tested.

PARAMETER MEASUREMENT INFORMATION

tsu

th

SCLK

D, CTL, LREQ

50%

Figure 1. D, CTL, LREQ Input Setup and Hold Timing Waveforms

td

SCLK

D, CTL

50%

Figure 2. D, CTL Output Delay Relative to SCLK Timing Waveforms