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ADM1029ARQZ-R7 数据表(PDF) 3 Page - ON Semiconductor |
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ADM1029ARQZ-R7 数据表(HTML) 3 Page - ON Semiconductor |
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3 / 50 page ![]() Rev. 1 | Page 3 of 50 | www.onsemi.com Parameter Min Typ Max Unit Test Conditions/Comments SERIAL BUS TIMING 5 (continued) SCL Low Time, tLOW 1.3 µs See Figure 1 SCL High Time, tHIGH 4 50 µs See Figure 1 SCL, SDA Rise Time, tR 1000 ns See Figure 1 SCL, SDA Fall Time, tF 300 ns See Figure 1 Data Setup Time, tSU:DAT 250 ns See Figure 1 Data Hold Time, tHD:DAT 300 ns See Figure 1 NOTES 1All voltages are measured with respect to GND, unless otherwise specified. 2Typicals are at T A = 25°C and represent most likely parametric norm. Shutdown current typ is measured with V CC = 3.3 V. 3TUE (Total Unadjusted Error) includes Offset, Gain, and Linearity errors of the ADC, multiplexer. 4The total fan count is based on two pulses per revolution of the fan tachometer output. 5Timing specifications are tested at logic levels of V IL = 0.8 V for a falling edge and VIH = 2.1 V for a rising edge. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS * Positive Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . 6.5 V Voltage on Pins 13–18 . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) Voltage on Any Other Input or Output Pin . . . . –0.3 V to +6.5 V Input Current at Any Pin . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA Package Input Current . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA Maximum Junction Temperature (TJ max) . . . . . . . . . . 150°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200°C ESD Rating All Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN CONFIGURATION ADM1029 TOP VIEW (Not To Scale) 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 DRIVE1 FAULT1 TACH1 PRESENT1 SCL SDA GND VCC CFAULT INT GPIO2 RESET DRIVE2 FAULT2 TACH2 PRESENT2 AIN1/GPIO1 AIN0/GPIO0 TMIN/INSTALL D2+/GPIO6 D2–/GPIO5 ADD D1+/GPIO4 D2–/GPIO3 THERMAL CHARACTERISTICS 24-Lead QSOP Package: θJA = 105°C/W, θJC = 39°C/W P S S P tHD;STA tHD;DAT tHIGH tSU;DAT tSU;STA tSU;STO tLOW tR tF tHD;STA SCL SDA tBUF Figure 1. Diagram for Serial Bus Timing ADM1029 |
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