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Thermal Specifications and Design Considerations

Thermal Specifications and

Design Considerations

5.1

Processor Thermal Specifications

The processor requires a thermal solution to maintain temperatures within the

operating limits as described in Section 5.1.1. Any attempt to operate the processor

outside these operating limits may result in permanent damage to the processor and

potentially other components within the system. As processor technology changes,

thermal management becomes increasingly crucial when building computer systems.

Maintaining the proper thermal environment is key to reliable, long-term system

operation.

A complete thermal solution includes both component and system level thermal

management features. Component level thermal solutions can include active or passive

heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system

level thermal solutions may consist of system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the

appropriate Thermal and Mechanical Design Guidelines (see Section 1.2).

Note:

The boxed processor will ship with a component thermal solution. Refer to Chapter 7

for details on the boxed processor.

5.1.1

Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based

systems, the system/processor thermal solution should be designed such that the

processor remains within the minimum and maximum case temperature (TC)

specifications when operating at or below the Thermal Design Power (TDP) value listed

per frequency in Table 26. Thermal solutions not designed to provide this level of

thermal capability may affect the long-term reliability of the processor and system. For

more details on thermal solution design, refer to the appropriate Thermal and

Mechanical Design Guidelines (see Section 1.2).

The processor uses a methodology for managing processor temperatures which is

intended to support acoustic noise reduction through fan speed control. Selection of the

appropriate fan speed is based on the relative temperature data reported by the

processor’s Platform Environment Control Interface (PECI) bus as described in

Section 5.4.1.1. The temperature reported over PECI is always a negative value and

represents a delta below the onset of thermal control circuit (TCC) activation, as

indicated by PROCHOT# (see Section 5.2). Systems that implement fan speed control

must be designed to take these conditions in to account. Systems that do not alter the

fan speed only need to ensure the case temperature meets the thermal profile

specifications.

To determine a processor's case temperature specification based on the thermal profile,

it is necessary to accurately measure processor power dissipation. Intel has developed

a methodology for accurate power measurement that correlates to Intel test

temperature and voltage conditions. Refer to the appropriate Thermal and Mechanical

Design Guidelines (see Section 1.2) and the Processor Power Characterization

Methodology for the details of this methodology.

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