E2000 datasheet(5/104 Pages) INTEL

5 / 104 page

Datasheet

Figures

1VCC Static and Transient Tolerance for Processors......................................................... 21

2VCC Overshoot Example Waveform ............................................................................. 22

Differential Clock Waveform ...................................................................................... 30

Differential Clock Crosspoint Specification ................................................................... 30

Differential Measurements......................................................................................... 30

Differential Clock Crosspoint Specification ................................................................... 31

Processor Package Assembly Sketch ........................................................................... 33

Processor Package Drawing Sheet 1 of 3 ..................................................................... 34

Processor Package Drawing Sheet 2 of 3 ..................................................................... 35

10 Processor Package Drawing Sheet 3 of 3 ..................................................................... 36

11 Processor Top-Side Markings Example ........................................................................ 38

12 Processor Land Coordinates and Quadrants, Top View ................................................... 39

13 land-out Diagram (Top View – Left Side) ..................................................................... 42

14 land-out Diagram (Top View – Right Side) ................................................................... 43

15 Thermal Profile (Intel® Pentium® Dual-Core Processors with CPUID = 06F2h).................. 75

16 Thermal Profile (Intel® Pentium® Dual-Core Processors with CPUID = 06FDh) ................. 76

17 Case Temperature (TC) Measurement Location ............................................................ 77

18 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 79

19 Processor PECI Topology ........................................................................................... 83

20 Conceptual Fan Control on PECI-Based Platforms ......................................................... 84

21 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 84

22 Processor Low Power State Machine ........................................................................... 88

23 Mechanical Representation of the Boxed Processor ....................................................... 93

24 Space Requirements for the Boxed Processor (Side View).............................................. 94

25 Space Requirements for the Boxed Processor (Top View)............................................... 95

26 Space Requirements for the Boxed Processor (Overall View) .......................................... 95

27 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 97

28 Baseboard Power Header Placement Relative to Processor Socket ................................... 98

29 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 99

30 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................... 99

31 Boxed Processor Fan Heatsink Set Points................................................................... 100

E2000 数据表(PDF) 5 Page - Intel Corporation