E2000 datasheet(3/104 Pages) INTEL

3 / 104 page

Datasheet

Contents

1Introduction ..............................................................................................................9

1.1

Terminology .......................................................................................................9

1.1.1

Processor Terminology ............................................................................ 10

1.2

References ....................................................................................................... 11

Electrical Specifications ........................................................................................... 13

2.1

Power and Ground Lands.................................................................................... 13

2.2

Decoupling Guidelines........................................................................................ 13

2.2.1

VCC Decoupling ..................................................................................... 13

2.2.2

Vtt Decoupling ....................................................................................... 13

2.2.3

FSB Decoupling...................................................................................... 14

2.3

Voltage Identification ......................................................................................... 14

2.4

Market Segment Identification (MSID) ................................................................. 16

2.5

Reserved, Unused, and TESTHI Signals ................................................................ 16

2.6

Voltage and Current Specification ........................................................................ 17

2.6.1

Absolute Maximum and Minimum Ratings .................................................. 17

2.6.2

DC Voltage and Current Specification ........................................................ 19

2.6.3

Vcc Overshoot ....................................................................................... 21

2.6.4

Die Voltage Validation ............................................................................. 22

2.7

Signaling Specifications...................................................................................... 22

2.7.1

FSB Signal Groups.................................................................................. 23

2.7.2

CMOS and Open Drain Signals ................................................................. 24

2.7.3

Processor DC Specifications ..................................................................... 25

2.7.3.1

GTL+ Front Side Bus Specifications ............................................. 26

2.8

Clock Specifications ........................................................................................... 28

2.8.1

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 28

2.8.2

FSB Frequency Select Signals (BSEL[2:0])................................................. 28

2.8.3

Phase Lock Loop (PLL) and Filter .............................................................. 29

2.8.4

BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 29

2.8.5

BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 31

2.9

PECI DC Specifications ....................................................................................... 32

Package Mechanical Specifications .......................................................................... 33

3.1

Package Mechanical Drawing............................................................................... 33

3.2

Processor Component Keep-Out Zones................................................................. 37

3.3

Package Loading Specifications ........................................................................... 37

3.4

Package Handling Guidelines............................................................................... 37

3.5

Package Insertion Specifications.......................................................................... 38

3.6

Processor Mass Specification............................................................................... 38

3.7

Processor Materials............................................................................................ 38

3.8

Processor Markings............................................................................................ 38

3.9

Processor Land Coordinates ................................................................................ 39

Land Listing and Signal Descriptions ....................................................................... 41

4.1

Processor Land Assignments ............................................................................... 41

4.2

Alphabetical Signals Reference ............................................................................ 64

Thermal Specifications and Design Considerations .................................................. 73

5.1

Processor Thermal Specifications ......................................................................... 73

5.1.1

Thermal Specifications ............................................................................ 73

5.1.2

Thermal Metrology ................................................................................. 77

5.2

Processor Thermal Features ................................................................................ 77

5.2.1

Thermal Monitor..................................................................................... 77

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