| 数据搜索系统,热门电子元器件搜索 |
|
E2000 数据表(PDF) 37 Page - Intel Corporation |
|
|
|||||||||||||||||||||||||||||
E2000 数据表(HTML) 37 Page - Intel Corporation |
|
37 / 104 page ![]() Datasheet 37 Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keep- out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 8 and Figure 9 for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. 3.3 Package Loading Specifications Table 20 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum loading specification must be maintained by any thermal and mechanical solutions. . 3.4 Package Handling Guidelines Table 21 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 20. Processor Loading Specifications Parameter Minimum Maximum Notes Static 80 N [17 lbf] 311 N [70 lbf] 1, 2, 3 NOTES: 1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS. 2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the processor package. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket. Dynamic — 756 N [170 lbf] 1, 3, 4 4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. Table 21. Package Handling Guidelines Parameter Maximum Recommended Notes Shear 311 N [70 lbf] 1, 2 NOTES: 1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. 2. These guidelines are based on limited testing for design characterization. Tensile 111 N [25 lbf] 2, 3 3. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface. Torque 3.95 N-m [35 lbf-in] 2, 4 4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |