E2000 datasheet(4/104 Pages) INTEL

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Datasheet

5.2.2

Thermal Monitor 2 ..................................................................................78

5.2.3

On-Demand Mode...................................................................................79

5.2.4

PROCHOT# Signal ..................................................................................80

5.2.5

THERMTRIP# Signal ................................................................................80

5.3

Thermal Diode...................................................................................................81

5.4

Platform Environment Control Interface (PECI) ......................................................83

5.4.1

Introduction...........................................................................................83

5.4.1.1

Key Difference with Legacy Diode-Based Thermal Management .......83

5.4.2

PECI Specifications .................................................................................85

5.4.2.1

PECI Device Address..................................................................85

5.4.2.2

PECI Command Support .............................................................85

5.4.2.3

PECI Fault Handling Requirements ...............................................85

5.4.2.4

PECI GetTemp0() Error Code Support ..........................................85

6Features ..................................................................................................................87

6.1

Power-On Configuration Options ..........................................................................87

6.2

Clock Control and Low Power States.....................................................................88

6.2.1

Normal State .........................................................................................88

6.2.2

HALT and Extended HALT Powerdown States ..............................................88

6.2.2.1

HALT Powerdown State ..............................................................89

6.2.2.2

Extended HALT Powerdown State ................................................89

6.2.3

Stop Grant and Extended Stop Grant States ...............................................89

6.2.3.1

Stop-Grant State.......................................................................90

6.2.3.2

Extended Stop Grant State .........................................................90

6.2.4

Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant

Snoop State, and Stop Grant Snoop State..................................................90

6.2.4.1

HALT Snoop State, Stop Grant Snoop State ..................................90

6.2.4.2

Extended HALT Snoop State, Extended Stop Grant Snoop State.......91

6.3

Enhanced Intel SpeedStep® Technology...............................................................91

Boxed Processor Specifications................................................................................93

7.1

Mechanical Specifications....................................................................................94

7.1.1

Boxed Processor Cooling Solution Dimensions.............................................94

7.1.2

Boxed Processor Fan Heatsink Weight .......................................................96

7.1.3

Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....96

7.2

Electrical Requirements ......................................................................................96

7.2.1

Fan Heatsink Power Supply ......................................................................96

7.3

Thermal Specifications........................................................................................98

7.3.1

Boxed Processor Cooling Requirements......................................................98

7.3.2

Fan Speed Control Operation (Intel® Pentium® Dual-Core Desktop

Processor E2000 Series) ........................................................................ 100

Debug Tools Specifications .................................................................................... 103

8.1

Logic Analyzer Interface (LAI) ........................................................................... 103

8.1.1

Mechanical Considerations ..................................................................... 103

8.1.2

Electrical Considerations ........................................................................ 103

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