AFS090 datasheet(176/334 Pages) MICROSEMI

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Device Architecture

2- 16 0

R e v isio n 2

User I/O Naming Convention

Due to the comprehensive and flexible nature of Fusion device user I/Os, a naming scheme is used to

show the details of the I/O (Figure 2-111 on page 2-160 and Figure 2-112 on page 2-161). The name

identifies to which I/O bank it belongs, as well as the pairing and pin polarity for differential I/Os.

I/O Nomenclature

= Gmn/IOuxwByVz

Gmn is only used for I/Os that also have CCC access—i.e., global pins.

= Global

= Global pin location associated with each CCC on the device: A (northwest corner), B (northeast corner), C

(east middle), D (southeast corner), E (southwest corner), and F (west middle).

= Global input MUX and pin number of the associated Global location m, either A0, A1, A2, B0, B1, B2, C0, C1,

or C2. Figure 2-22 on page 2-27 shows the three input pins per clock source MUX at CCC location m.

= I/O pair number in the bank, starting at 00 from the northwest I/O bank and proceeding in a clockwise

direction.

= P (Positive) or N (Negative) for differential pairs, or R (Regular – single-ended) for the I/Os that support single-

ended and voltage-referenced I/O standards only. U (Positive-LVDS only) or V (Negative-LVDS only) restrict

the I/O differential pair from being selected as an LVPECL pair.

= D (Differential Pair), P (Pair), or S (Single-Ended). D (Differential Pair) if both members of the pair are bonded

out to adjacent pins or are separated only by one GND or NC pin; P (Pair) if both members of the pair are

bonded out but do not meet the adjacency requirement; or S (Single-Ended) if the I/O pair is not bonded out.

For Differential (D) pairs, adjacency for ball grid packages means only vertical or horizontal. Diagonal

adjacency does not meet the requirements for a true differential pair.

= Bank

= Bank number (0–3). The Bank number starts at 0 from the northwest I/O bank and proceeds in a clockwise

direction.

= Reference voltage

= Minibank number

Figure 2-111 • Naming Conventions of Fusion Devices with Three Digital I/O Banks

CCC

"A"

CCC

"E"

CCC/PLL

"F"

CCC

"B"

CCC

"D"

CCC

"C"

AFS090

Standard I/O Bank

Analog Quads

AFS250

Bank 3

Bank 1

Bank 2 (analog)

Bank 0

AFS090 数据表(PDF) 176 Page - Microsemi Corporation

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