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SPC56AP54X 数据表(PDF) 82 Page - STMicroelectronics |
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SPC56AP54X 数据表(HTML) 82 Page - STMicroelectronics |
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82 / 104 page ![]() Electrical characteristics SPC56xP54x, SPC56xP60x 82/104 Doc ID 18340 Rev 3 3. The maximum program and erase times occur after the specified number of program/erase cycles. These maximum values are characterized but not guaranteed. 4. Actual hardware programming times. This does not include software overhead. 5. Typical bank programming time assumes that all cells are programmed in a single pulse. In reality some cells will require more than one pulse, adding a small overhead to total bank programming time (see Initial Max column). 6. Time between erase suspend resume and next erase suspend. Table 34. Flash memory module life Symbol Parameter Conditions Value Unit Min Typ P/E C Number of program/erase cycles per block for 16 KB blocks over the operating temperature range (TJ) — 100000 100000 cycles P/E C Number of program/erase cycles per block for 32 KB blocks over the operating temperature range (TJ) — 10000 100000 cycles P/E C Number of program/erase cycles per block for 64 KB blocks over the operating temperature range (TJ) — 10000 100000 cycles P/E C Number of program/erase cycles per block for 128 KB blocks over the operating temperature range (TJ) — 1000 100000 cycles Retention C Minimum data retention at 85 °C average ambient temperature(1) Blocks with 0 – 1000 P/E cycles 20 — years Blocks with 10000 P/E cycles 10 — years Blocks with 100000 P/E cycles 5— years 1. Ambient temperature averaged over duration of application, not to exceed recommended product operating temperature range. Table 35. Flash read access timing Symbol C Parameter Conditions(1) 1. VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C, unless otherwise specified Max Unit Fmax C Maximum working frequency for Code Flash at given number of WS in worst conditions 2 wait states 66 MHz 0 wait states 22 Fmax C Maximum working frequency for Data Flash at given number of WS in worst conditions 8 wait states 66 MHz |
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