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CDCM7005 数据表(PDF) 8 Page - Texas Instruments

部件名 CDCM7005
功能描述  3.3-V HIGH PERFORMANCE CLOCK SYNCHRONIZER AND JITTER CLEANER
PDF  45 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

CDCM7005 数据表(HTML) 8 Page - Texas Instruments

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CDCM7005
SCAS793E – JUNE 2005 – REVISED FEBRUARY 2013
www.ti.com
DEVICE CHARACTERISTICS (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LVCMOS
Output frequency, see (1), (2), Figure 6,
Load = 5 pF to GND, 1 k
Ω to VCC, 1 kΩ
fclk
250
MHz
and Figure 7
to GND
VIK
LVCMOS input clamp voltage
VCC = 3 V, II = –18 mA
–1.2
V
LVCMOS input current for CTRL_LE,
II
VI = 0 V or VCC, VCC = 3.6 V
±5
µA
CTRL_CLK, CTRL_DATA
LVCMOS input current for PD, RESET,
IIH
HOLD, REF_SEL, PRI_REF,
VI = VCC, VCC = 3.6 V
5
µA
SEC_REF, (see (3))
LVCMOS input current for PD, RESET,
IIL
HOLD, REF_SEL, PRI_REF,
VI = 0 V, VCC = 3.6 V
–15
–35
µA
SEC_REF, (see (3))
VCC = min to max,
VCC–0.1
IOH = –100 μA
High-level output voltage for LVCMOS
VOH
V
outputs
VCC = 3 V, IOH = –6 mA
2.4
VCC = 3 V, IOH = –12 mA
2
VCC = min to max,
0.1
IOL = 100 μA
Low-level output voltage for LVCMOS
VOL
V
outputs
VCC = 3 V, IOL = 6 mA
0.5
VCC = 3 V, IOL = 12 mA
0.8
IOH
High-level output current
VCC = 3.3 V, VO = 1.65 V
–30
mA
IOL
Low-level output current
VCC = 3.3 V, VO = 1.65 V
33
mA
VREF_IN = VCC/2, Y = VCC/2,
tpho
Phase offset (REF_IN to Y output)(4)
1.8
ns
see Figure 11, Load = 10 pF
tsk(p)
LVCMOS pulse skew, see Figure 10
Crosspoint to VCC/2 load, see Figure 12
150
ps
tpd(LH)
Crosspoint to VCC/2,
Propagation delay from VCXO_IN to
Load = 10 pF, see Figure 12 (PLL
2
2.5
3
ns
Yx, see Figure 10
tpd(HL)
bypass mode)
All outputs have the same divider ratio
55
LVCMOS single-ended output skew,
tsk(o)
ps
see (5) and Figure 10
Outputs have different divider ratios
70
Duty cycle
LVCMOS
VCC/2 to VCC/2
49%
51%
20% to 80% of swing (load
tslew-rate
Output rise/fall slew rate
2.4
3.5
V/ns
see Figure 12)
LVPECL
fclk
Output frequency, see (6) and Figure 5
Load, see Figure 13
0
1500
MHz
II
LVPECL input current
VI = 0 V or VCC
±20
µA
VOH
LVPECL high-level output voltage
Load, See Figure 13
VCC–1.18
VCC–0.81
V
VOL
LVPECL low-level output voltage
Load, See Figure 13
VCC–2
VCC–1.55
V
|VOD|
Differential output voltage
See Figure 9 and load, see Figure 13
500
mV
VREF_IN = VCC/2 to cross point of Y,
tpho
Phase offset (REF_IN to Y output)(5)
–200
100
ps
see Figure 11
tpd(LH)
Propagation delay time, VCXO_IN to
Cross point-to-cross point, load
340
490
640
ps
Yx, see Figure 10
see Figure 13
tpd(HL)
Cross point-to-cross point, load
tsk(p)
LVPECL pulse skew, see Figure 10
10
ps
see Figure 13
(1)
fclk can be up to 400 MHz in the typical operating mode (25°C / 3.3-V VCC). The total power consumption limit of 700 mW for the BGA
package can be violated if several LVCMOS outputs switch at high frequency (see Figure 3 and Figure 4).
(2)
Operating the LVCMOS or LVPECL output above the maximum frequency will not cause a malfunction to the device, but the output
signal swing may no longer meet the output specification.
(3)
These inputs have an internal 150-k
Ω pullup resistor.
(4)
This is valid only for the same frequency of REF_IN clock and Y output clock. It can be adjusted by the SPI controller (reference delay M
and VCXO delay N).
(5)
The tsk(o) specification is only valid for equal loading of all outputs.
(6)
Operating the LVCMOS or LVPECL output above the maximum frequency will not cause a malfunction to the device, but the output
signal swing may no longer meet the output specification.
8
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