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PIC24FJ64GA 数据表(PDF) 49 Page - Microchip Technology |
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PIC24FJ64GA 数据表(HTML) 49 Page - Microchip Technology |
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49 / 52 page  © 2008 Microchip Technology Inc. DS39768D-page 49 PIC24FJXXXGA0XX 7.0 AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS Standard Operating Conditions Operating Temperature: 0 °C to +70°C. Programming at +25°C is recommended. Param No. Symbol Characteristic Min Max Units Conditions D111 VDD Supply Voltage During Programming VDDCORE + 0.1 3.60 V Normal programming(1,2) D112 IPP Programming Current on MCLR —5 μA D113 IDDP Supply Current During Programming — 2 mA D031 VIL Input Low Voltage VSS 0.2 VDD V D041 VIH Input High Voltage 0.8 VDD VDD V D080 VOL Output Low Voltage — 0.4 V IOL = 8.5 mA @ 3.6V D090 VOH Output High Voltage 3.0 — V IOH = -3.0 mA @ 3.6V D012 CIO Capacitive Loading on I/O pin (PGDx) — 50 pF To meet AC specifications D013 CF Filter Capacitor Value on VCAP 4.7 10 μF Required for controller core P1 TPGC Serial Clock (PGCx) Period 100 — ns P1A TPGCL Serial Clock (PGCx) Low Time 40 — ns P1B TPGCH Serial Clock (PGCx) High Time 40 — ns P2 TSET1 Input Data Setup Time to Serial Clock ↑ 15 — ns P3 THLD1 Input Data Hold Time from PGCx ↑ 15 — ns P4 TDLY1 Delay Between 4-Bit Command and Command Operand 40 — ns P4A TDLY1A Delay Between 4-Bit Command Operand and Next 4-Bit Command 40 — ns P5 TDLY2 Delay Between Last PGCx ↓ of Command Byte to First PGCx ↑ of Read of Data Word 20 — ns P6 TSET2VDD ↑ Setup Time to MCLR ↑ 100 — ns P7 THLD2 Input Data Hold Time from MCLR ↑ 25 — ms P8 TDLY3 Delay Between Last PGCx ↓ of Command Byte to PGDx ↑ by Programming Executive 12 — μs P9 TDLY4 Programming Executive Command Processing Time 40 — μs P10 TDLY6 PGCx Low Time After Programming 400 — ns P11 TDLY7 Chip Erase Time 400 — ms P12 TDLY8 Page Erase Time 40 — ms P13 TDLY9 Row Programming Time 2 — ms P14 TR MCLR Rise Time to Enter ICSP™ mode — 1.0 μs P15 TVALID Data Out Valid from PGCx ↑ 10 — ns P16 TDLY10 Delay Between Last PGCx ↓ and MCLR ↓ 0— s P17 THLD3MCLR ↓ to VDD ↓ 100 — ns P18 TKEY1 Delay from First MCLR ↓ to First PGCx ↑ for Key Sequence on PGDx 40 — ns P19 TKEY2 Delay from Last PGCx ↓ for Key Sequence on PGDx to Second MCLR ↑ 1— ms P20 TDLY11 Delay Between PGDx ↓ by Programming Executive to PGDx Driven by Host 23 — µs P21 TDLY12 Delay Between Programming Executive Command Response Words 8— ns Note 1: VDDCORE must be supplied to the VDDCORE/VCAP pin if the on-chip voltage regulator is disabled. See Section 2.1 “Power Requirements” for more information. (Minimum VDDCORE allowing Flash programming is 2.25V.) 2: VDD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be within ±0.3V of VDD and VSS, respectively. |
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