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LSM330 数据表(PDF) 30 Page - STMicroelectronics |
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LSM330 数据表(HTML) 30 Page - STMicroelectronics |
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30 / 75 page  Application hints LSM330 30/75 DocID023426 Rev 3 5 Application hints Figure 14. LSM330 electrical connections 5.1 External capacitors The device core is supplied through the Vdd line. Power supply decoupling capacitors (C2, C3=100 nF ceramic, C4=10 μF Al) should be placed as near as possible to the supply pin of the device (common design practice). All voltage and ground supplies must be present at the same time to achieve proper behavior of the IC (refer to Figure 14). RES RES RES RES (TOP VIEW) 1 3 1 6 18 SCL_A/G VDD_IO SDA/SDI_A/G SDO_G 10nF(25V) *C1 100 nF GND GND 10 μF C3 C4 Vdd Vdd_IO GND 100 nF C2 GND GND * C1 must guarantee 1 nF value under 11 V bias condition Vdd_IO I2C configuration SCL SDA Rpu= 10kOhm Rpu Pull-up to be added AM14726V1 |
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