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LSM330 数据表(PDF) 31 Page - STMicroelectronics |
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LSM330 数据表(HTML) 31 Page - STMicroelectronics |
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31 / 75 page  DocID023426 Rev 3 31/75 LSM330 Application hints 75 The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the SPI/I2C interface. The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely programmed by the user through the SPI/I2C interface. 5.2 Soldering information The LGA package is compliant with ECOPACK®, RoHS and “Green” standards. It is qualified for soldering heat resistance according to JEDEC J-STD-020D. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. |
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