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STM8TL52X4 数据表(PDF) 75 Page - STMicroelectronics |
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STM8TL52X4 数据表(HTML) 75 Page - STMicroelectronics |
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75 / 84 page  DocID022344 Rev 7 75/84 STM8TL52x4 STM8TL53x4 Package information 79 Figure 35. UFQFPN28 - 28-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package recommended footprint 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 36. UFQFPN28 marking example (package top view) 1. Parts marked as “ES”,”E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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