STM8TL52X4 datasheet(77/84 Pages) STMICROELECTRONICS

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STM8TL52x4 STM8TL53x4

Package information

Figure 38. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package footprint

1. Dimensions are expressed in millimeters.

0.450

0.600

0.750

0.0177

0.0236

0.0295

1.000

0.0394

0°

8°

0°

8°

aaa

0.100

0.0039

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15mm per side.

3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not

exceed 0.25mm per side.

Table 43. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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