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STM32L162VC 数据表(PDF) 97 Page - STMicroelectronics

部件名 STM32L162VC
功能描述  Ultra-low-power platform
PDF  123 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32L162VC 数据表(HTML) 97 Page - STMicroelectronics

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STM32L162VC, STM32L162RC
104
Figure 27. Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 9. The applicable
procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors
should be ceramic (good quality). They should be placed as close as possible to the chip.
ADC clock
Sampling (n cycles)
Conversion (12 cycles)
Iref+
300µA
700µA
MS36686V1
Table 58. Maximum source impedance RAIN max(1)
Ts
(µs)
RAIN max (kΩ)
Ts (cycles)
fADC=16 MHz(2)
Multiplexed channels
Direct channels
2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced
with respect to the minimum sampling time Ts (µs),



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