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STM32L162VC 数据表(PDF) 121 Page - STMicroelectronics

部件名 STM32L162VC
功能描述  Ultra-low-power platform
PDF  123 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32L162VC 数据表(HTML) 121 Page - STMicroelectronics

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STM32L162VC, STM32L162RC
122
19-May-2014
6
(continued)
Updated Table 48: I2C characteristics.
Removed minimum values for fS in Table 56: ADC characteristics.
Updated Output impedance values in Table 59: DAC characteristics.
Moved Table 61: Temperature sensor calibration values from
Section 3.10.1: Temperature sensor to Section 6.3.20: Temperature
sensor characteristics and updated the table. Removed note 4 in
Table 62: Temperature sensor characteristics.
Modified General PCB design guidelines.
Removed figures “Power supply and reference decoupling (VREF+ not
connected to VDDA) and “Power supply and reference decoupling
(VREF+ connected to VDDA)”.
Updated Figure 26: Typical connection diagram using the ADC.
Added “Marking of engineering samples” sections in Figure : In order
to meet environmental requirements, ST offers these devices in
different grades of ECOPACK® packages, depending on their level of
environmental compliance. ECOPACK® specifications, grade
definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark..
Updated the conditions in Table 26: Low-power mode wakeup timings.
Removed ambiguity of “ambient temperature” in the electrical
characteristics description.
13-Oct-2014
7
Updated Section 3.18: Communication interfaces putting I2S
characteristics inside.
Updated DMIPS features in cover page and Section 2: Description.
Updated max temperature at 105°C instead of 85°C in the whole
datasheet.
Updated Table 9: STM32L162xC pin definitions with additional
functions column.
Updated current consumption in Table 20: Current consumption in
Sleep mode.
Updated Table 25: Peripheral current consumption with new measured
current values.
Updated Table 58: Maximum source impedance RAIN max adding
note 2.
06-Mar-2015
8
Updated Section 7: Package information with new package device
marking.
Updated Figure 6: Memory map.
Table 72. Document revision history (continued)
Date
Revision
Changes



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