DA6505.005

11 June 2018

41 (44)

MAS6505 IN QFN-24 4x4x0.85 PACKAGE

Top Marking Information:

MAS6505 = Product Number

VVV = Product Version

YYWW = Year Week

XXXXX = Lot Number

QFN-24 4x4x0.85 PIN DESCRIPTION

Pin Name

Pin

Type

Function

Notes

SCK

1

DI

Serial bus clock input in I2C and SPI

SDI

2

DI/O

Data input/output in I2C

Data input in 4-wire SPI / Data input/output in 3-wire SPI

CSB

3

DI

Bus mode select / chip select with pull-up

CSB=VDDIO: I2C mode / chip not selected

CSB=GND: SPI mode / chip selected

1

VDDIO

4

P

Positive supply voltage for serial bus interface

2

VDD

5

P

Positive supply voltage

6-7

NC

3

GND

8

G

Supply ground

GNDS

9

AO

Sensor bridge supply ground

NI

10

AI

Negative sensor signal input

ETEST

11

AI/O

EEPROM test

4

PI

12

AI

Positive sensor signal input

13-20

NC

3

VDDS

21

P

Supply voltage for sensor bridge and external sensing diode

TD

22

AI/O

External temperature sensing diode cathode connection

5

23

NC

3

SDO

24

DO

Data output in 4-wire SPI mode

Test input/output in test mode

6

NC = Not Connected, P = Power, G = Ground, DO = Digital Output, DI = Digital Input, AO = Analog Output, AI = Analog Input

Note 1: In I2C mode the unused CSB pin must be left unconnected (floating). The CSB pin has internal

250 kΩ pull-up resistor to VDDIO.

To minimize current consumption the pin should be kept high (at VDDIO) except during chip select events of SPI bus communication mode.

Note 2: If there is no separate supply voltage available for the serial bus interface the VDDIO must be tied to VDD.

Note 3: The not connected (NC) pins should be connected to supply ground (GND) for minimum noise.

Note 4: The ETEST pin must be left unconnected (floating). It is only for EEPROM testing purpose.

Note 5: Optional external temperature sensing diode is connected between VDDS (anode) and TD (cathode). The unused TD pin is left

unconnected.

Note 6: In I2C and 3-wire SPI modes the unused SDO pin must be left unconnected (floating).

Note: On PCB the exposed pad is recommended to be connected to GND for minimum noise. It can be also left floating but it cannot be

connected to any other potential than GND.