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MPC8275VR 数据表(PDF) 71 Page - Motorola, Inc

部件名 MPC8275VR
功能描述  PowerQUICC II Family Hardware Specifications
PDF  76 Pages
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制造商  MOTOROLA [Motorola, Inc]
网页  http://www.freescale.com
标志 MOTOROLA - Motorola, Inc

MPC8275VR 数据表(HTML) 71 Page - Motorola, Inc

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MOTOROLA
MPC8280 PowerQUICC II™ Family Hardware Specifications
71
Package Description
9
Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1
Package Parameters
Package parameters are provided in Table 23.
1 Should be tied to VDDH via a 2K Ω external pull-up resistor.
2 The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
3 Must be pulled down or left floating.
4 If PCI is not desired, must be pulled up or left floating.
5 Sphere is not connected to die.
6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in
Section 4.3, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can
leave the pin connected to GND with the noise filtering capacitors.
7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no
need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in
which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Table 23. Package Parameters
Package
Devices
Outline
(mm)
Type
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
ZU
MPC8280
MPC8270
37.5 x 37.5
TBGA
480
1.27
1.55
VR
MPC8275VR
MPC8270VR
27 x 27
PBGA
516
1
2.25
ZQ
MPC8275ZQ
MPC8270ZQ
27 x 27
PBGA
516
1
2.25



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