MPC8275VR datasheet(74/76 Pages) MOTOROLA

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MPC8280 PowerQUICC II™ Family Hardware Speciﬁcations

MOTOROLA

Ordering Information

Figure 19 provides an example of the Motorola part numbering nomenclature for the MPC8280. In addition

to the processor frequency, the part numbering scheme also consists of a part modiﬁer that indicates any

enhancement(s) in the part from the original production design. Each part number also contains a revision

code that refers to the die mask revision number and is speciﬁed in the part numbering scheme for

identiﬁcation purposes only. For more information, contact your local Motorola sales ofﬁce.

Figure 19. Motorola Part Number Key

Document Revision History

Table 24. Document Revision History

Revision

Date

Substantive Changes

0.1

—

Initial public release

0.2

11/2002 Table 22, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 63)

0.3

6/2003

• Removal of notes stating “no local bus” on VR-package devices. The MPC8270VR and the

MPC8275VR have local bus support.

• References to “G2 core” changed to “G2_LE core.” Refer to the G2 Core Reference Manual

(G2CORERM/D).

• Addition of VCCSYN to “Note” below Table 4, and to note 3 of Table 5

• Figure 2: New

• Table 5: Addition of note 1

• Table 6: Addition of

θJB and θJC. Modiﬁcations to ZU package values.

• Table 7: Addition of various conﬁgurations, Modiﬁcation of values. Addition of note 3.

• Table 9: Addition of 66 MHZ and 100 MHz values. Addition of sp42a/sp43a.

• Table 10: Addition of 66 MHZ and 100 MHz values

• Table 12: sp30 values. sp33b @100 MHz value. Removal of previous note 2. Modiﬁcation of

current note 2.

• Figure 5, Figure 6, Figure 7, and Figure 8: Addition of notes

• Section 6.2: Addition of note on PCI timing

• Table 15, Table 16, Table 17, Table 18, Table 19: Addition of note 1 concerning minimum

operating frequencies

• Addition of statement before clock tables about selection of clock conﬁguration and input

frequency

• Table 20 and Table 22: Addition of note 1 to CPM pins

Product Code

Device Number

Package

Processor Frequency

Die Revision Level

MPC 82XX C ZU XXX

(CPU/CPM/Bus)

Temperature Range

Blank = 0T

to 105Tj

C = (-40)T

– 105Tj

ZU = 480 TBGA Lead spheres

VR = 516 PBGA Lead-free spheres

ZQ = 516 PBGA Lead spheres

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