MPC8275VR datasheet(72/76 Pages) MOTOROLA

部件名	MPC8275VR

功能描述	PowerQUICC II Family Hardware Specifications

PDF	76 Pages

Scroll/Zoom	100%

制造商	MOTOROLA [Motorola, Inc]

网页	http://www.freescale.com

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72 / 76 page

MPC8280 PowerQUICC II™ Family Hardware Speciﬁcations

MOTOROLA

Package Description

9.2

Mechanical Dimensions

Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU)

package. Refer to Table 2.

Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA

Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA (VR/ZQ)

packages.

Dim

Millimeters

Min

Max

1.45

1.65

0.60

0.70

0.85

0.95

0.25

—

0.65

0.85

37.50 BSC

35.56 REF

1.27 BSC

37.50 BSC

35.56 REF

Notes:

1. Dimensions and Tolerancing per

ASME Y14.5M-1994.

2. Dimensions in millimeters.

3. Dimension b is measured at the

maximum solder ball diameter,

parallel to primary data A.

4. Primary data A and the seating

plane are deﬁned by the spherical

crowns of the solder balls.

MPC8275VR 数据表(PDF) 72 Page - Motorola, Inc

MPC8275VR 数据表(HTML) 72 Page - Motorola, Inc

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