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EM62100AGH 数据表(PDF) 9 Page - ELAN Microelectronics Corp |
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EM62100AGH 数据表(HTML) 9 Page - ELAN Microelectronics Corp |
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9 / 60 page ![]() EM62100 65 COM/132 SEG STN LCD Driver Product Specification (V1.1) 09.13.2005 •••• 3 (This specification is subject to change without further notice) 100 um 40 40 20 40 40 20 100 um 3.1 PIN DIMENSIONS Size Item Pad No. X Y Unit Chip size - 8200 1000 1 ~ 62 , 79~122 , 140 ~ 295 35 80 123 ~ 139 , 296 ~ 312 80 35 Bump Size 63 ~78 50 58 Pad Pitch 50 (min.) m Die thickness (excluding bumps) 20 ±1 mil ( 525 ± 25 m) Bump Height 17 ± 2 Minimum Bump Gap 15 Coordinate Origin Chip center 3.2 MARK DIMENSIONS Mark Coordinate (X, Y) Left -3763.05 ,125.15 Right 3748.5 ,125.1 3.3 Alignment Key |
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