UCS2113 datasheet(56/62 Pages) MICROCHIP

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UCS2113

DS20005680B-page 56

 2016-2021 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

2.80

MILLIMETERS

0.50 BSC

MIN

MAX

4.00

Contact Pad Length (X20)

Contact Pad Width (X20)

0.80

0.30

NOM

20-Lead Plastic Quad Flat, No Lead Package (G4) - 4x4 mm Body [QFN]

SILK SCREEN

Contact Pad Spacing

4.00

Contact Pad to Center Pad (X16)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

ØV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Also called VQFN

Microchip Technology Drawing C04-2126-G4 Rev D

UCS2113 数据表(PDF) 56 Page - Microchip Technology

UCS2113 数据表(HTML) 56 Page - Microchip Technology

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