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STM8S103F2 数据表(PDF) 92 Page - STMicroelectronics |
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STM8S103F2 数据表(HTML) 92 Page - STMicroelectronics |
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92 / 121 page ![]() Package information STM8S103F2 STM8S103F3 STM8S103K3 92/121 DocID15441 Rev 14 11.2 UFQFPN32 package information Figure 48. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. 4. Dimensions are in millimeters. |
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