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SPC58EEX 数据表(PDF) 140 Page - STMicroelectronics |
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SPC58EEX 数据表(HTML) 140 Page - STMicroelectronics |
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140 / 154 page ![]() Package information SPC58EEx, SPC58NEx 140/154 DS11646 Rev 4 measuring the temperature at the bottom center of the package case (exposed pad) using the following equation: Equation 5 TJ = TB + (ΨJPB x PD) where: TT = thermocouple temperature on bottom of the package (°C) ΨJT = thermal characterization parameter (°C/W) PD = power dissipation in the package (W) |
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