SPC58EEX datasheet(137/154 Pages) STMICROELECTRONICS

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DS11646 Rev 4

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SPC58EEx, SPC58NEx

Package information

140

4.3

Package thermal characteristics

The following tables describe the thermal characteristics of the device. The parameters in

this chapter have been evaluated by considering the device consumption configuration

reported in the Section 3.7: Device consumption.

4.3.1

LQFP176

4.3.2

FPBGA292

Table 80. Thermal characteristics for 176 exposed pad LQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection(2) Four layer board (2s2p)

20.9

°C/W

RθJMA

Junction-to-Moving-Air, Ambient(2)

at 200 ft./min., four layer

board (2s2p)

15.3

°C/W

RθJB

Junction-to-board(3)

—9

°C/W

RθJCtop

Junction-to-case top(4)

—

7.3

°C/W

RθJCbottom CC D

Junction-to-case bottom(5)

—1

°C/W

ΨJT

Junction-to-package top(6)

Natural convection

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 81. Thermal characteristics for 292-pin FPBGA

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection (2) Four layer board (2s2p)

21.3

°C/W

RθJB

Junction-to-board(3)

—9.8

°C/W

RθJC

Junction-to-case(4)

—6.5

°C/W

ΨJT

Junction-to-package top(5)

Natural convection

0.6

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

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