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ADP1850ACPZ-R7 数据表(PDF) 20 Page - Analog Devices

部件名 ADP1850ACPZ-R7
功能描述  Wide Range Input, Dual/Two-Phase, DC-to-DC Synchronous Buck Controller
PDF  32 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP1850ACPZ-R7 数据表(HTML) 20 Page - Analog Devices

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ADP1850
Data Sheet
Rev. C | Page 20 of 32
The high-side MOSFET transition loss is approximated by the
equation
2
)
(
SW
F
R
LOAD
IN
T
f
t
t
I
V
P
×
+
×
×
where:
PT is the high-side MOSFET switching loss power.
tR is the rise time in charging the high-side MOSFET.
tF is the fall time in discharging the high-side MOSFET.
tR and tF can be estimated by
RISE
DRIVER
GSW
R
I
Q
t
_
FALL
DRIVER
GSW
F
I
Q
t
_
where:
QGSW is the gate charge of the MOSFET during switching and is
given in the MOSFET data sheet.
IDRIVER_RISEand IDRIVER_FALLare the driver current put out by the
ADP1850 internal gate drivers.
If QGSW is not given in the data sheet, it can be approximated by
2
GS
GD
GSW
Q
Q
Q
+
where:
QGD and QGS are the gate-to-drain and gate-to-source charges
given in the MOSFET data sheet.
IDRIVER_RISE and IDRIVER_FALL can be estimated by
GATE
SOURCE
ON
SP
DD
RISE
DRIVER
R
R
V
V
I
+
_
_
GATE
SINK
ON
SP
FALL
DRIVER
R
R
V
I
+
_
_
where:
VDD is the input supply voltage to the driver and is between 2.75 V
and 5 V, depending on the input voltage.
VSP is the switching point where the MOSFET fully conducts;
this voltage can be estimated by inspecting the gate charge
graph given in the MOSFET data sheet.
RON_SOURCE is the on resistance of the ADP1850 internal driver,
given in Table 1 when charging the MOSFET.
RON_SINK is the on resistance of the ADP1850 internal driver,
given in Table 1 when discharging the MOSFET.
RGATE is the on gate resistance of MOSFET given in the
MOSFET data sheet. If an external gate resistor is added, add
this external resistance to RGATE.
The total power dissipation of the high-side MOSFET is the
sum of conduction and transition losses:
T
C
HS
P
P
P
+
The synchronous rectifier, or low-side MOSFET, carries the
inductor current when the high-side MOSFET is off. The low-
side MOSFET transition loss is small and can be neglected in
the calculation. For high input voltage and low output voltage,
the low-side MOSFET carries the current most of the time.
Therefore, to achieve high efficiency, it is critical to optimize
the low-side MOSFET for low on resistance. In cases where the
power loss exceeds the MOSFET rating or lower resistance is
required than is available in a single MOSFET, connect multiple
low-side MOSFETs in parallel. The equation for low-side
MOSFET conduction power loss is
×
IN
OUT
DSON
LOAD
CLS
V
V
R
I
P
1
)
(
2
There is also additional power loss during the time, known as
dead time, between the turn-off of the high-side switch and the
turn-on of the low-side switch, when the body diode of the low-
side MOSFET conducts the output current. The power loss in
the body diode is given by
O
SW
D
F
BODYDIODE
I
f
t
V
P
×
×
×
=
where:
VF is the forward voltage drop of the body diode, typically 0.7 V.
tD is the dead time in the ADP1850, typically 30 ns when driving
some medium-size MOSFETs with input capacitance, Ciss, of
approximately 3 nF. The dead time is not fixed. Its effective
value varies with gate drive resistance and Ciss, so PBODYDIODE
increases in high load current designs and low voltage designs.
Then the power loss in the low-side MOSFET is
BODYDIODE
CLS
LS
P
P
P
+
=
Note that MOSFET, RDSON, increases with increasing tempera-
ture with a typical temperature coefficient of 0.4%/oC. The
MOSFET junction temperature (TJ) rise over the ambient
temperature is
TJ = TA + θJA × PD
where:
θJA is the thermal resistance of the MOSFET package.
TA is the ambient temperature.
PD is the total power dissipated in the MOSFET.



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