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ADP1850ACPZ-R7 数据表(PDF) 20 Page - Analog Devices |
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ADP1850ACPZ-R7 数据表(HTML) 20 Page - Analog Devices |
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20 / 32 page ![]() ADP1850 Data Sheet Rev. C | Page 20 of 32 The high-side MOSFET transition loss is approximated by the equation 2 ) ( SW F R LOAD IN T f t t I V P × + × × ≅ where: PT is the high-side MOSFET switching loss power. tR is the rise time in charging the high-side MOSFET. tF is the fall time in discharging the high-side MOSFET. tR and tF can be estimated by RISE DRIVER GSW R I Q t _ ≅ FALL DRIVER GSW F I Q t _ ≅ where: QGSW is the gate charge of the MOSFET during switching and is given in the MOSFET data sheet. IDRIVER_RISEand IDRIVER_FALLare the driver current put out by the ADP1850 internal gate drivers. If QGSW is not given in the data sheet, it can be approximated by 2 GS GD GSW Q Q Q + ≅ where: QGD and QGS are the gate-to-drain and gate-to-source charges given in the MOSFET data sheet. IDRIVER_RISE and IDRIVER_FALL can be estimated by GATE SOURCE ON SP DD RISE DRIVER R R V V I + − ≅ _ _ GATE SINK ON SP FALL DRIVER R R V I + ≅ _ _ where: VDD is the input supply voltage to the driver and is between 2.75 V and 5 V, depending on the input voltage. VSP is the switching point where the MOSFET fully conducts; this voltage can be estimated by inspecting the gate charge graph given in the MOSFET data sheet. RON_SOURCE is the on resistance of the ADP1850 internal driver, given in Table 1 when charging the MOSFET. RON_SINK is the on resistance of the ADP1850 internal driver, given in Table 1 when discharging the MOSFET. RGATE is the on gate resistance of MOSFET given in the MOSFET data sheet. If an external gate resistor is added, add this external resistance to RGATE. The total power dissipation of the high-side MOSFET is the sum of conduction and transition losses: T C HS P P P + ≅ The synchronous rectifier, or low-side MOSFET, carries the inductor current when the high-side MOSFET is off. The low- side MOSFET transition loss is small and can be neglected in the calculation. For high input voltage and low output voltage, the low-side MOSFET carries the current most of the time. Therefore, to achieve high efficiency, it is critical to optimize the low-side MOSFET for low on resistance. In cases where the power loss exceeds the MOSFET rating or lower resistance is required than is available in a single MOSFET, connect multiple low-side MOSFETs in parallel. The equation for low-side MOSFET conduction power loss is − × ≅ IN OUT DSON LOAD CLS V V R I P 1 ) ( 2 There is also additional power loss during the time, known as dead time, between the turn-off of the high-side switch and the turn-on of the low-side switch, when the body diode of the low- side MOSFET conducts the output current. The power loss in the body diode is given by O SW D F BODYDIODE I f t V P × × × = where: VF is the forward voltage drop of the body diode, typically 0.7 V. tD is the dead time in the ADP1850, typically 30 ns when driving some medium-size MOSFETs with input capacitance, Ciss, of approximately 3 nF. The dead time is not fixed. Its effective value varies with gate drive resistance and Ciss, so PBODYDIODE increases in high load current designs and low voltage designs. Then the power loss in the low-side MOSFET is BODYDIODE CLS LS P P P + = Note that MOSFET, RDSON, increases with increasing tempera- ture with a typical temperature coefficient of 0.4%/oC. The MOSFET junction temperature (TJ) rise over the ambient temperature is TJ = TA + θJA × PD where: θJA is the thermal resistance of the MOSFET package. TA is the ambient temperature. PD is the total power dissipated in the MOSFET. |
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