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STM32L082KB 数据表(PDF) 51 Page - STMicroelectronics |
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STM32L082KB 数据表(HTML) 51 Page - STMicroelectronics |
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51 / 132 page ![]() DS10688 Rev 7 51/132 STM32L082xx Electrical characteristics 109 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 20: Voltage characteristics, Table 21: Current characteristics, and Table 22: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard. Extended mission profiles are available on demand. Table 20. Voltage characteristics Symbol Definition Min Max Unit VDD–VSS External main supply voltage (including VDDA, VDD_USB, VDD)(1) 1. All main power (VDD,VDD_USB, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the permitted range. –0.3 4.0 V VIN(2) 2. VIN maximum must always be respected. Refer to Table 21 for maximum allowed injected current values. Input voltage on FT and FTf pins VSS −0.3 VDD+4.0 Input voltage on TC pins VSS −0.3 4.0 Input voltage on BOOT0 VSS VDD +4.0 Input voltage on any other pin VSS −0.3 4.0 | ΔVDD| Variations between different VDDx power pins - 50 mV |VDDA-VDDx| Variations between any VDDx and VDDA power pins(3) 3. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and VDDA can be tolerated during power-up and device operation. VDD_USB is independent from VDD and VDDA: its value does not need to respect this rule. - 300 | ΔVSS| Variations between all different ground pins - 50 VREF+ –VDDA Allowed voltage difference for VREF+ > VDDA -0.4 V VESD(HBM) Electrostatic discharge voltage (human body model) see Section 6.3.11 |
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