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STM32L082KB 数据表(PDF) 124 Page - STMicroelectronics |
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STM32L082KB 数据表(HTML) 124 Page - STMicroelectronics |
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124 / 132 page ![]() Package information STM32L082xx 124/132 DS10688 Rev 7 7.5 Thermal characteristics The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max × ΘJA) Where: • TA max is the maximum ambient temperature in ° C, •ΘJA is the package junction-to-ambient thermal resistance, in ° C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. Table 82. Thermal characteristics(1) 1. TBD stands fro “to be defined”. Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient UFQFPN32 - 5 x 5 mm / 0.5 mm pitch 36 °C/W Thermal resistance junction-ambient LQFP32 - 7 x 7 mm / 0.8 mm pitch 60 Thermal resistance junction-ambient UFQFPN48 - 7 x 7 mm / 0.5 mm pitch 28 Thermal resistance junction-ambient WLCSP49 - 0.4 mm pitch 48 |
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