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STM32H757AI 数据表(PDF) 245 Page - STMicroelectronics |
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STM32H757AI 数据表(HTML) 245 Page - STMicroelectronics |
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245 / 251 page  DS12931 Rev 1 245/251 STM32H757xI Package information 249 Figure 84. TFBGA240+25 package recommended footprint 1. Dimensions are expressed in millimeters. Table 137. TFBG240+25 ball package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A - - 1.100 - - 0.0433 A1 0.150 - - 0.0059 - - A2 - 0.760 - - 0.0299 - b 0.350 0.400 0.450 0.0138 0.0157 0.0177 D 13.850 14.000 14.150 0.5453 0.5512 0.5571 D1 - 12.800 - - 0.5039 - E 13.850 14.000 14.150 0.5453 0.5512 0.5571 E1 - 12.800 - - 0.5039 - e - 0.800 - - 0.0315 - F - 0.600 - - 0.0236 - G - 0.600 - - 0.0236 - ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 A07U_FP_V2 Dpad Dsm |
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