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NXP Semiconductors

33982

PACKAGING

Packaging

Soldering information

SOLDERING INFORMATION

The 33982 is packaged in a surface mount power package (PQFN), intended to be soldered directly on the printed circuit board.

The AN2467 provides guidelines for Printed Circuit Board design and assembly.

Package dimensions

For the most current revision of the package, visit www.nxp.com and perform a keyword search on 98ARL10596D and 98ASA00815D.

Dimensions shown are provided for reference ONLY.

Table 19.

Suffix

Package outline drawing number

CHFK

98ARL10521D

EHFK

98ASA00815D