NXP Semiconductors

7

33982

ELECTRICAL CHARACTERISTICS

THERMAL RATINGS

TA

TJ

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

C

TSTG

Storage Temperature

-55 to 150

C

RJC

RJA

Thermal Resistance

Junction-to-Case

Junction-to-Ambient

<1.0

30

C/W

(6)

TPPRT

Peak Package Reflow Temperature During Reflow

Note 8

°C

(7), (8)

Notes

6.

Device mounted on a 2s2p test board per JEDEC JESD51-2.

7.

Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

malfunction or permanent damage to the device.

8.

NXP’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and

Moisture Sensitivity Levels (MSL), Go to www.nxp.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all

orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 3. Maximum ratings

All voltages are with respect to ground unless otherwise noted.

Symbol

Rating

Value

Unit

Notes