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33982 数据表(PDF) 43 Page - NXP Semiconductors |
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33982 数据表(HTML) 43 Page - NXP Semiconductors |
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43 / 47 page ![]() NXP Semiconductors 43 33982 ADDITIONAL DOCUMENTATION Figure 13. Surface mount for power PQFN with exposed pads Figure 14. Thermal test board Note: Recommended via diameter is 0.5 mm. PTH (plated through hole) via must be plugged / filled with epoxy or solder mask in order to minimize void formation and to avoid any solder wicking into the via. 1.0 1.0 0.2 0.2 * All measurements are in millimeters HS HS 16 15 VPWR 14 GND 13 1 11 10 9 8 7 6 5 4 3 2 12 16-Pin PQFN 0.90 mm Pitch 12.0 mm x 12.0 mm Body 33982 Pin Connections Transparent Top View A A |
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