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Mechanical Data

7.1 Thermal Data for ZWT

TMS320C6421

Fixed-Point Digital Signal Processor

SPRS346A – JANUARY 2007 – REVISED MARCH 2007

The following table(s) show the thermal resistance characteristics for the PBGA–ZWT and ZDU

mechanical package(s).

TBD see Power Application Report

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

Junction-to-case

5.4

N/A

Junction-to-board

16.0

N/A

26.6

0.00

Junction-to-free air

21.9

1.0

20.4

2.00

0.0

0.00

PsiJT

Junction-to-package top

0.1

1.0

0.2

2.00

15.9

0.00

PsiJB

Junction-to-board

15.8

1.0

15.3

2.00

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

(2)

m/s = meters per second

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