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ADBMS2950BCCSZ 数据表(PDF) 13 Page - Analog Devices |
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ADBMS2950BCCSZ 数据表(HTML) 13 Page - Analog Devices |
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13 / 97 page  Data Sheet ADBMS2950B Rev. 0 | Page 13 of 97 ABSOLUTE MAXIMUM RATINGS Voltages relative to GND, unless otherwise noted. Table 18. Parameter Rating Supply Pins VDD (VREG − 0.3V) to 21V VREG 6V DRIVE −0.3V to +7V SGND −0.1V to +0.1V RGND −0.1V to +0.1V Current Inputs S1A, I1A, I1B −4V to +4V S2A, I2A, I2B −4V to +4V I3A, I3B −4V to +4V IxA to IxB −4V to +4V Voltage Inputs V1 to V10 −0.3V to +6V VBAT1, VBAT2 −0.3V to +6V Digital Input/Output Pins GPIO1 to GPIO4 −0.3V to +6V GPO1 to GPO6 −0.3V to (VDD + 0.3V) OCA, OCB −0.3V to (VREG + 0.3V) IPA1, IMA1 , IPB, IMB −15V to +15V SCK1 , CSB1 −0.3V to +6V All Other Pins −0.3V to +6V Current In/Out of Pins2 VREF1P25 −5 mA to +5 mA VREG −5 mA to +54 mA GPO1 to GPO6 −2 mA to +2 mA OCA, OCB −12 mA to +12 mA GPIO1 to GPIO4 −10 mA to +10 mA SDO −10 mA to +10 mA IPA, IMA, IPB, IMB −40 mA to +40 mA V1 to V10, VBAT1, VBAT2 −10 mA to +4 mA Sum of Currents into Pins V1 to V10, VBAT1, VBAT2, VREF1P25, OCA, OCB3 +4 mA Temperature Operating Junction Temperature Range (TJ) −40°C to +125°C Junction Temperature (TJMAX) 150°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C ESD Classifications Human Body Model (HBM) Level 2 Charged Device Model (CDM) Level C2 1 IPA and SCK are the same pin. IMA and CSB are the same pin. The absolute maximum rating for these pins depends on whether Port A is configured for SPI mode (CSB and SCK) or isoSPI mode (IPA and IMA). 2 Positive currents flow into pins, negative currents flow out of pins. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction-to- ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction-to-case thermal resistance. Table 19. Thermal Resistance Package Type θJA θJC Unit CS-48 28 3 K/W ESD CAUTION 3 Those pins are clamped to VREG through internal diodes, this maximum sum of currents is sunk into the VREG pin regardless of whether the device is powered or not. It is guaranteed that the mentioned pins do not exceed their absolute maximum voltage rating in this condition. For more details, see the Protection Features section. |
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