M24C64-R datasheet(44/54 Pages) STMICROELECTRONICS

部件名	M24C64-R

功能描述	64-Kbit serial I²C bus EEPROM

PDF	54 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

44 / 54 page

Package information

M24C64-W M24C64-R M24C64-F M24C64-DF

44/54

DS6638 Rev 36

Figure 28. WLCSP - 5-bump, 0.959 x 1.073 mm, 0.4 mm pitch wafer level chip scale

recommended footprint

1. Dimensions are expressed in millimeters.

Table 27. WLCSP- 5-bump, 0.959 x 1.073 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.455

0.545

0.645

0.0179

0.0215

0.0254

0.190

0.0075

0.355

0.0140

b(2)

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.270

0.0106

0.959

1.074

0.0378

0.0423

1.073

1.168

0.0422

0.0460

0.693

0.0273

0.400

0.0157

0.3465

0.0136

0.280

0.0110

0.190

0.0075

aaa

0.110

0.0043

bbb

0.110

0.0043

M24C64-R 数据表(PDF) 44 Page - STMicroelectronics

M24C64-R 数据表(HTML) 44 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54

数据表下载