M24C64-R datasheet(41/54 Pages) STMICROELECTRONICS

部件名	M24C64-R

功能描述	64-Kbit serial I²C bus EEPROM

PDF	54 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

41 / 54 page

DS6638 Rev 36

41/54

M24C64-W M24C64-R M24C64-F M24C64-DF

Package information

9.6

WLCSP4 ultra thin package information

Figure 25. Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm,wafer level chip

scale package outline

1. Drawing is not to scale.

2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

Table 26. Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip

scale package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.285

0.315

0.345

0.0112

0.0124

0.0136

0.115

0.0045

0.175

0.0069

A3 (BSC)

0.025

0.0010

b(2) (3)

0.160

0.0063

0.795

0.815

0.0313

0.0321

0.674

0.694

0.0265

0.0273

0.400

0.0157

0.137

0.0054

0.198

0.0078

aaa

0.110

0.0043

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