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M24C64-R 数据表(PDF) 35 Page - STMicroelectronics |
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M24C64-R 数据表(HTML) 35 Page - STMicroelectronics |
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35 / 54 page ![]() DS6638 Rev 36 35/54 M24C64-W M24C64-R M24C64-F M24C64-DF Package information 53 Figure 19. UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead recommended footprint 1. Dimensions are expressed in millimeters. Y - 0.200 - - 0.0079 - e - 0.400 - - 0.0157 - L 0.500 0.550 0.600 0.0197 0.0217 0.0236 L1 - 0.100 - - 0.0039 - k - 0.400 - - 0.0157 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension b applies to plated terminal and is measured between 0.15 and 0.30mm from the terminal tip. Table 21. UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead - package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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