M24C64-R datasheet(34/54 Pages) STMICROELECTRONICS

34 / 54 page

Package information

M24C64-W M24C64-R M24C64-F M24C64-DF

34/54

DS6638 Rev 36

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

For die information concerning the M24C64 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

9.1

UFDFPN5 (DFN5) package information

Figure 18. UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package outline

1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.

Table 21. UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.500

0.550

0.600

0.0197

0.0217

0.0236

0.000

0.050

0.0000

0.0020

b(2)

0.175

0.200

0.225

0.0069

0.0079

0.0089

1.600

1.700

1.800

0.0630

0.0669

0.0709

1.400

1.500

1.600

0.0551

0.0591

0.0630

1.300

1.400

1.500

0.0512

0.0551

0.0591

0.175

0.200

0.225

0.0069

0.0079

0.0089

0.200

0.0079

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