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M24C64-R 数据表(PDF) 43 Page - STMicroelectronics |
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M24C64-R 数据表(HTML) 43 Page - STMicroelectronics |
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43 / 54 page ![]() DS6638 Rev 36 43/54 M24C64-W M24C64-R M24C64-F M24C64-DF Package information 53 9.7 WLCSP5 package information Figure 27. WLCSP 5-bump, 0.959 x 1.073 mm, 0.4 mm pitch wafer level chip scale (M24C64-FCS6TP/K)- package outline 1. Drawing is not to scale. 2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow). |
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