M24C64-R datasheet(36/54 Pages) STMICROELECTRONICS

36 / 54 page

Package information

M24C64-W M24C64-R M24C64-F M24C64-DF

36/54

DS6638 Rev 36

9.2

UFDFPN8 (DFN8) package information

Figure 20. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch

dual flat package, no lead - package outline

1. Drawing is not to scale.

2. The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating

(not connected) in the end application.

Table 22. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,

no lead - package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Min

Typ

Max

Min

Typ

Max

0.450

0.550

0.600

0.0177

0.0217

0.0236

0.000

0.020

0.050

0.0000

0.0008

0.0020

0.200

0.250

0.300

0.0079

0.0098

0.0118

1.900

2.000

2.100

0.0748

0.0787

0.0827

1.200

1.600

0.0472

0.0630

2.900

3.000

3.100

0.1142

0.1181

0.1220

1.200

1.600

0.0472

0.0630

0.500

0.0197

0.300

0.0118

0.300

0.500

0.0118

0.0197

0.150

0.0059

0.300

0.0118

eee(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.080

0.0031

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