M24C64-R datasheet(42/54 Pages) STMICROELECTRONICS

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M24C64-R 数据表(PDF) 42 Page - STMicroelectronics

部件名	M24C64-R

功能描述	64-Kbit serial I²C bus EEPROM

PDF	54 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

42 / 54 page

Package information

M24C64-W M24C64-R M24C64-F M24C64-DF

42/54

DS6638 Rev 36

Figure 26. Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip scale

package recommended footprint

1. Dimensions are expressed in millimeters.

bbb

0.110

0.0043

ccc

0.110

0.0043

ddd

0.060

0.0024

eee

0.060

0.0024

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

Table 26. Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip

scale package mechanical data (continued)

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