4.2

Recommended operating conditions

All voltages referred to ground pins unless otherwise specified. The junction temperature must be maintained

within recommended operating conditions with proper thermal design.

Table 3. Recommended operating conditions

Symbol

Parameter

Note

Min.

Max.

Unit

VCC

Logic supply voltage

10.7

18

V

VVCC-PGND

Logic supply voltage vs. PGND

7.5

20

V

PGND

Low-side driver ground

-3

3

V

VBO

VBOOT-OUT pin voltage

(1)

7.5

20

V

VOUT

DC output voltage

-9.3 (2)

520

V

Transient output voltage

ttrans < 1 ms

600

V

VCCL

Low-side driver voltage vs. GND

3

V

CIN

Comparator input voltage

0

15

V

Vi

Logic inputs voltage range

0

20

V

CVCCH, CVCCL

Driver supply voltage bypass capacitors (3)

47

470

nF

CBOOT

High-side driver linear regulator input capacitors (4)

CVCCH

3300

nF

tINmin

Minimum duration of input pulse

50

ns

fSW

Switching frequency (5)

Duty cycle = 50%

2

MHz

TJ-op

Junction temperature

-40

125

°C

1. VBOOT = VBOOT-GND must be ≥ 5 V to propagate high-side commands.

2. VBO = 20 V, VCC = 10.7 V

3. X7R, 16 V, Ceramic capacitor having ESR lower or equal to 50 mΩ.

4. X7R, 50 V, Ceramic capacitor having ESR lower or equal to 50 mΩ.

5. Actual limit depends on power dissipation constraints.

4.3

Thermal data

Table 4. Thermal data

Symbol

Parameter

Value

Unit

Rth(J-A)

Thermal resistance junction-to-ambient (1)

85

°C/W

Rth(J-A)

Thermal resistance junction-to-ambient (2)

110

°C/W

1. The thermal resistance is obtained simulating the device mounted on a 2s2p (4 layer) FR4 board according to JESD51-7

without PCB thermal vias.

2. The thermal resistance is obtained simulating the device mounted on a 1s0p (1 layer) FR4 board according to JESD51-3.

STDRIVEG611

Device ratings

DS14457 - Rev 2

page 7/33