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FT600Q-B-R 数据表(PDF) 25 Page - Future Technology Devices International Ltd. |
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FT600Q-B-R 数据表(HTML) 25 Page - Future Technology Devices International Ltd. |
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25 / 33 page ![]() Copyright © Future Technology Devices International Limited 25 FT600Q-FT601Q IC DatasheetDatasheet Version 1.04 Document No.: FT_001118 Clearance No.: FTDI#424 8 Package Parameters The FT60x is available in two different packages based on the FIFO bus interface. The FT600Q is the QFN- 56 package 16-bit FIFO bus interface and the FT601Q is the QFN-76 package 32-bit FIFO interface. 8.1 QFN-56 Package Mechanical Dimensions Figure 8.1 QFN-56 Package Dimensions The FT600Q is supplied in a RoHS compliant 56 pin QFN package. The package is lead (Pb) free and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 7.0mm x 7.0 mm body and the pins are on a 0.4 mm pitch. The above mechanical drawing shows the QFN-56 package. All dimensions are in millimetres. The centre pad on the base of the FT600Q is internally connected to GND; the PCB should connect to ground and not have signal tracking on the same layer as the chip in this area. |
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